According to the latest announcement, semiconductor production in Russia from 2030 will even be innovative on a global scale. Yes…
After all the regulations and sanctions from Taiwan, the US, the UK and the European Union (and related company organizations), the Russian government has launched a national program aimed at developing its own manufacturing technology for 28nm-class integrated circuits by 2030. The mentioned 7-nm scanner it will be a big or even huge step forward.
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This proudly announced Russian silicon wafer irradiator with appropriate circuits that are eaten in later stages is currently under development, with the current plan to be in place by 2028. As promised, when it is ready (or ” if it’s ever ready”), it will be more efficient than ASML’s Twinscan NXT: 2000i, which took more than a decade to develop.
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However, it’s hard not to get the impression that all these announcements (making 28-nm chips by 2030 and getting a scanner to make 7-nm chips by 2028) are pretty empty. Let’s recall that at the moment there is a company in Russia that is able to produce chips using the 65 nm technology at most, and due to the sanctions, the state must also ensure the production of silicon wafers suitable for 28-nm and then 7-nm , which the market giants have dominated for decades.
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Also interesting is the announcement by the Institute of Applied Physics of the Russian Academy of Sciences, according to which their scanner will be more advanced and generally better than the works of the biggest players in the market with its exposure length of 11.3 nm. This will be achieved with the use of much more advanced optics, which will allow to reduce the required power of the light source below 600 watts, thus reducing the dimensions of the scanner and the degree of difficulty in its use.